Helmut-Fischer FISCHERSCOPE® XDV®

Speed meets precision.

Built for maximum speed, highest precision, and intuitive ease of use – that’s how we introduce the new generation of XRF instruments with our FISCHERSCOPE® XDV®. As one of our high-end XRF solutions, the instrument is designed for measuring on microstructures with confidence. Combined with our cutting-edge FISIQ® X software, the device delivers outstanding measuring performance. In addition, simplified and efficient workflows ensure smooth measurement processes and significantly increased throughput in your quality control.

• Super-fast sample positioning.

High-speed Z-axis 6 x faster*

• Rapid sample capture.

Autofocus in under 2 seconds – 14 x faster*

• Automated operation.

Automated or manual hood for maximum flexibility

• Optimum sample illumination and picture capture.

10 x higher* camera resolution and multizone LED lighting

_{* In comparison to FISCHERSCOPE® X-RAY XDV®-SDD.}

• Unparalleled high precision and repeatable results.

Optimized measurement geometry

• Device status always visible.

Intuitive 180° status light

• Enhanced usability and user guidance.

New FISIQ® X software

• Analysis of very thin coatings, e.g., gold/palladium coatings of ≤ 50 nm (0.002 mils)
• Measurements of functional coatings in the electronics and semiconductor industries, e.g. determination of the coating thickness of gold layers down to 2 nm (0.00008 mils) for lead frames
• Measurement of ultra-thin coatings on silicon wafers
• Determination of light element coatings on wafers (Al, Ti, NiP)
• Fuel cell and battery foils: metals (Pt, Ir, Ce; Ni, Co, Mn) in organic matrix (carbon)
• Gold analysis with highest requirements
• Measurement of complex multilayer systems
• Automated measurements, e.g. in quality control