Helmut-Fischer FISCHERSCOPE® XDAL®

Innovative benchtop instrument for coating thickness measurement of very thin and complex coatings, even < 0.05 μm, as well as for material analysis in the ppm range.

Ask a question

Description Features Applications

Easy handling, maximum speed and precision.

When precision pushes boundaries, our FISCHERSCOPE® XDAL® redefines what’s possible. The innovative successor to our FISCHERSCOPE® X-RAY XDAL® is ideal for applications in the field of thin and very thin coatings < 0.05 μm and for material analysis in the ppm range. You can choose between our models XDAL® 650, equipped with our powerful silicon drift detector 50 mm², and XDAL® 620, equipped with a silicon drift detector 20 mm². Together with our cutting-edge FISIQ® X XRF software, this high-end solution ensures a smooth measuring process for greater convenience, safety, and maximum throughput.

Super-fast sample positioning.

High-speed Z-axis 6 x faster*

Rapid sample capture.

Autofocus in under 2 seconds – 14 x faster*

Automated operation.

Automated or manual hood for maximum flexibility

Optimum sample illumination and picture capture.

10 x higher* camera resolution and multizone LED lighting

_{* In comparison to FISCHERSCOPE® X-RAY XDAL® 237.}

Unparalleled high precision and repeatable results.

Optimized measurement geometry

Device status always visible.

Intuitive 180° status light

Enhanced usability and user guidance.

New FISIQ® X software

Large parts.

C-slot allows large part measurement

Microfocus tube with tungsten anode, other anodes available on request
C-slot housing for measuring larger samples
Silicon drift detector 20 mm² or 50 mm² for highest precision on thin layers
4-fold changeable apertures and 6-fold changeable filters
Individual approval as fully protected instrument
FISIQ® X software with AI-supported spectrum mode for smarter measurement processes
Stepless measuring distance with measuring top down
Up to 140 mm possible heights of samples
Automated hood and programmable measuring table for automated measurements

Analysis of very thin coatings of ≤ 0.1 μm (0.004 mils)
Measurements of functional coatings in the electronics and semiconductor industries, e.g. on lead frames, connectors, or printed circuit boards
Measurement of complex multilayer systems
Automated measurements, e.g., in quality control
Determination of the lead content in solder
Determination of the phosphorous content in NiP coatings
Determination of PCB finishes