Special device for automated measuring and analysis of smallest structures, very thin coatings and multilayer systems on wafers with diameters up to 12 inches.
The FISCHERSCOPE® X-RAY XDV®-μ SEMI is the optimal measuring solution for fully automated inspection of microstructures on wafers. The automated wafer handling and inspection process ensures very high efficiency and enables error-free handling and measurement of wafers due to consistent inspection conditions through an encapsulated inspection environment. The powerful detector, microfocus tube Ultra, and polycapillary optics for smallest measuring spots guarantee an outstanding measuring performance.
This automation solution is available as a pre-engineered solution, which means you benefit from a proven, existing hardware and software design. Together, we modify and adapt your automated measuring system according to your requirements.
Perfectly fitted for 24/7 use and smooth measuring processes
Integrated CCTV monitoring of the complete handling process
Large service hatches for access to individual components
Shorter measuring times or improvement of standard deviation*
*compared to the DPP
No contamination of the wafers as well as constant measuring conditions
Automated measurements on predefined structures thanks to advanced pattern recognition technology
Our in-house manufactured polycapillary optics deliver outstanding measurement results with short measurement times
Coating thickness measurement and elemental analysis of
