Measure copper thickness on printed circuit boards quickly, accurately, non-destructively, and without the influence of underlying copper layers, with the SR-SCOPE® DMP30.
Robust and powerful handheld device for measuring copper thickness on printed circuit boards
Measuring method: Micro resistance
Measured value memory: 250,000 measured values in 2,500 batches
Rugged aluminum housing with IP64 protection, Gorilla Glass and soft bumpers
Exchangeable Li-Ion battery for > 24 h operating time
Easy data transfer via USB-C and Bluetooth
Live feedback via light, sound and vibration for limit monitoring
Cal Check function to verify your currently used calibration
Digital probe available
Available with the new Tactile Suite software
Applications
Measurement of copper thickness on the top side of printed circuit boards and multilayers, without insulated deeper copper layers influencing the measurement.
Measuring range with probe D-PCB: copper layer thicknesses from 0.5 - 10 µm and 5 - 120 µm
With extensive functionalities and processed in a robust and high-quality housing with a modern design and intuitive Tactile Suite software, our SR-SCOPE® DMP30 is the ideal choice for measuring copper layers on printed circuit boards. Connect the D-PCB digital probe to the SR-SCOPE DMP30 and measure conductivity using the electrical 4-point resistance method according to DIN EN 14571.
Robust and handy device for fast and exact determination of ferrite content onsite
Display of the measured value in ferrite percentage (% Fe) or as ferrite number (FE)
Large and easily readable display with comprehensive functions
Measures automatically as soon as the probe is applied
Various probes available for reliable measurement even in hard-to-reach areas
Large choice of calibration materials available
Just one calibration required for the entire measurement area
Also available as a module with full functionality for the stationary measurement instrument MMS PC2
