Home/Produkti/Helmut-Fischer FISCHERSCOPE X-RAY XDV-µ SEMI, XRF for inspecting wafer microstructures
Helmut-Fischer FISCHERSCOPE X-RAY XDV-µ SEMI, XRF for inspecting wafer microstructures
Helmut-Fischer FISCHERSCOPE X-RAY XDV-µ SEMI, XRF for inspecting wafer microstructures
Helmut-Fischer FISCHERSCOPE X-RAY XDV-µ SEMI, XRF for inspecting wafer microstructures
The accurate and fully automated test station for 2.5/3D packaging applications.[embed]https://www.youtube.com/watch?v=FtR_b9kPg_s&feature=emb_logo[/embed]
The FISCHERSCOPE X-RAY XDV-μ SEMI is an automated measurement system optimized for the quality control of micro-structures in complex 2.5D/3D packaging applications in the semiconductor industry. Fully automated analysis prevents damage to valuable wafer material. And consistent test conditions deliver reliable results. The instrument is suitable for use in clean rooms, and a comprehensive equipment catalog allows simple integration into existing wafer fabs.
Fully automated wafer handling and test process enables efficient staff deployment
Can precisely test structures up to 10 µm in diameter
Automatically locates positions to be measured with image recognition
Simple operation via Fischer WinFTM software
Individually applicable: manual measurements are possible at any time
Flexible: docking station for FOUP, SMIF and cassette, for 6"", 8"" and 12"" wafers
